"FPGA vs. ASIC Design" Panel to Kick Off IEC Executive Forum @ DesignCon 2004
CHICAGO, December 17, 2004 -The International Engineering Consortium (IEC)
has announced that the IEC Executive Forum @ DesignCon 2004 will begin on
Wednesday, February 4, 2004 at 9:00 a.m. at the Santa Clara Convention
Center (Santa Clara, Calif.) with a panel discussion titled "FPGA vs. ASIC
Design," sponsored by Mentor Graphics (Nasdaq:MENT).
Industry leaders in both field-programmable gate arrays vs.
application-specific integrated circuits will debate the pros and cons of
FPGAs and ASICs as well as the viable emerging alternative, the structured
ASIC solution; and discuss how all three are shaping the future of
electronic design automation. David Bursky, editor-at-large for Electronic
Design Magazine, will chair the panel.
Panelists include Steve Douglass, senior director of new product
development for the Advanced Products Group at Xilinx; Bryan Lewis, director
and chief analyst, Gartner Dataquest; Jim Smith, director of EDA vendor
relations, Altera; Richard Tobias, vice president of the ASIC and Foundry
Business Unit, Toshiba America Electronic Components; and Ronnie Vasishta,
vice president of technology product marketing at LSI Logic.
The Executive Forum provides an educational opportunity for industry
leaders, with a full day of complimentary programming and the opportunity to
meet, network, and trade knowledge and expertise in an interactive
educational atmosphere.
Following the opening panel, DesignCon Conference Chair Greg Spirakis of
Intel moderates the Plenary Panel, "The Roadmap to 65 Nanometers: Design
Needs and Technical Challenges." Tsugio Makimoto, corporate advisor for
semicondutor operations at Sony Corporation , delivers the Wednesday keynote
address preceding the opening of the technology exhibition at 12:30 pm.
The Executive Forum concludes with two Monday afternoon panels, "EDA
Licensing Models" at 2:30 p.m., chaired by Richard Tobias; and "Leadership
in Times of Change" at 4:00 p.m., chaired by Mark Pierpoint, vice president
of marketing, Agilent Technologies.
As DesignCon continues to grow, the IEC Executive Forum @ DesignCon
increasingly becomes an important experience for senior-level managers and
executives in the semiconductor and EDA industries.
The Executive Forum is part of DesignCon's comprehensive educational
program. Additional highlights of the program include keynote addresses by
Aart de Geus, chairman and chief executive officer, Synopsys; and Jan
Rabaey, professor and director of the Gigascale Research Laboratory at the
University of California, Berkeley.
About DesignCon (http://www.designcon.com)
The DesignCon conference program provides education and updates on the
latest technology news and advances affecting design engineers working at
the chip, board, and system levels. DesignCon 2004 will feature specialized
tutorials on nanotechnology and a new conference track devoted to wireless
topics. The DesignCon technology exhibition delivers practical approaches,
techniques, and procedures directly on the show floor, where leading-edge
displays from key organizations offer proven solutions for immediate
application.
About the IEC (http://www.iec.org)
The International Engineering Consortium (IEC) is a nonprofit organization
dedicated to catalyzing technology and business progress worldwide in a
range of high-technology industries and their university communities. Since
1944, the IEC has provided high-quality educational opportunities for
industry professionals, academics, and students. In conjunction with
industry-leading companies, the IEC has developed an extensive, free,
on-line educational program. The IEC conducts industry-university programs
that have substantial impact on curricula. It also conducts research and
develops publications, conferences, and technological exhibits that address
major opportunities and challenges of the information age. More than 70
leading high-technology universities are IEC affiliates, and the IEC handles
the affairs of the Electrical and Computer Engineering Department Heads
Association.
